Interposer and semiconductor device
AssigneeRohm Co., Ltd.
InventorsYasumasa Kasuya, Sadamasa Fujii, Motoharu Haga
Life of this patent
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Abstract
An interposer and a semiconductor device including the interposer, which can prevent thermal warpage of an insulative substrate. The interposer is provided with a semiconductor chip in a semiconductor device and may be disposed between the semiconductor chip and a mount board. The interposer includes: a substrate of an insulative resin; an island on one surface of the substrate to be bonded to a rear surface of the chip; a thermal pad on the other surface opposite the one surface opposed to the island with the intervention of the substrate; and a thermal via extending through the substrate from the one surface to the other surface to thermally connect the island to the thermal pad.
Claims22
An interposer to be provided together with a semiconductor chip in a semiconductor device and, when the semiconductor device is mounted on a mount board, disposed between the semiconductor chip and the mount board, the interposer comprising:
- an insulative substrate of an insulative resin;
- an island provided on one surface of the insulative substrate to be bonded to a rear surface of the semiconductor chip via a bonding agent;
- a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate;
- thermal vias extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner;
- metal terminals formed on the other surface of the insulative substrate;
- and
- connection vias, being different from thermal vias, extending through the insulative substrate from the one surface to the other surface to be connected to the metal terminals respectively,
- wherein the thermal vias include a first thermal via having a relatively-large diameter and a second thermal via having a relatively-small diameter, and
- each of the connection vias has a diameter that is smaller than the diameter of the first thermal via and larger than the diameter of the second thermal via.
An interposer comprising:
- an insulative substrate having via-holes arranged in a matrix array with an electrically conductive island provided on a front surface thereof;
- wherein the insulative substrate has heat dissipation via-holes provided in addition to the via-holes arranged in the matrix array in a region thereof opposed to the island,
- the heat dissipation via-holes include a first heat dissipation via-hole having a relatively-large diameter and a second heat dissipation via-hole having a relatively-small diameter, and
- each of the connection via-holes has a diameter that is smaller than the diameter of the first heat dissipation via-hole and larger than the diameter of the second heat dissipation via-hole.
A semiconductor device comprising:
- a semiconductor chip;
- an insulative substrate of an insulative resin;
- an island provided on one surface of the insulative substrate and bonded to a rear surface of the semiconductor chip via a bonding agent;
- a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate;
- thermal vias extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner;
- metal terminals formed on the other surface of the insulative substrate;
- and
- connection vias, being different from thermal vias, extending through the insulative substrate from the one surface to the other surface to be connected to the metal terminals respectively,
- wherein the thermal vias include a first thermal via having a relatively-large diameter and a second thermal via having a relatively-small diameter, and
- each of the connection vias has a diameter that is smaller than the diameter of the first thermal via and larger than the diameter of the second thermal via.
A semiconductor device comprising:
- an insulative substrate having via-holes arranged in a matrix array with an electrically conductive island provided on a front surface thereof;
- and
- a semiconductor chip die-bonded to the island via an electrically conductive layer;
- wherein the insulative substrate has heat dissipation via-holes provided in addition to the via-holes arranged in the matrix array in a region thereof opposed to the island,
- the heat dissipation via-holes include a first heat dissipation via-hole having a relatively-large diameter and a second heat dissipation via-hole having a relatively-small diameter, and
- each of the connection via-holes has a diameter that is smaller than the diameter of the first heat dissipation via-hole and larger than the diameter of the second heat dissipation via-hole.
Dependencies are inferred from the claim text.