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US 7,923,829 B2Granted
Bonding pad sharing method applied to multi-chip module and apparatus thereof
AssigneeMediatek Inc.
InventorsHsien-Chyi Chiou, Jui-Ming Wei
Life of this patent
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Abstract
A multi-chip module (MCM) includes a first die and a second die. The first die supports a plurality of predetermined functions. The second die is coupled to the first die and comprises at least an option pad configured for a bonding option. The first die performs a predetermined function according to a bonding status of the option pad of the second die.
Claims6
A multi-chip module (MCM), comprising:
- a first die, supporting a plurality of predetermined functions;
- and
- a second die, coupled to the first die, comprising at least an option pad configured for a bonding option;
- wherein the first die performs a predetermined function according to a bonding status of the option pad of the second die, the second die is a memory die having a device identification based on the bonding status of the option pad, and the first die accesses the device identification to perform the predetermined function corresponding to the device identification.
1 more element
A boding pad sharing method applied to a multi-chip module (MCM), comprising:
- configuring the MCM to have a first die and a second die, wherein the first die supports a plurality of predetermined functions, and the second die is coupled to the first die and comprises at least an option pad configured for a bonding option;
- configuring the first die to perform a predetermined function according to a bonding status of the option pad of the second die;
- implementing the second die utilizing a memory die having a device identification based on the bonding status of the option pad;
- and
- utilizing the first die to access the device identification and then perform the redetermined function corresponding to the device identification.
2 more elements
Dependencies are inferred from the claim text.