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US 7,923,825 B2Granted
Integrated circuit package
AssigneeNational Semiconductor Corporation
InventorsJaime A. Bayan, Anindya Poddar
Life of this patent
Estimating the term…
Abstract
An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conducting upper routing traces formed on the bottom surface of the substrate. The traces on the bottom surface of the substrate electrically couple each lower contact lead with an associated I/O pad.
Claims15
An integrated circuit package, comprising:
- an integrated circuit die, the die having an active surface and a back surface substantially opposite the active surface, the active surface including a plurality of I/O pads;
- a plurality of lower contact leads, each lower contact lead having a first solder-wettable surface and a second surface substantially opposite the first solder-wettable surface;
- and
- an insulating substrate having a plurality of electrically conducting upper routing traces formed on a bottom surface thereof, wherein ones of the traces have at least one inner solder-wettable portion and at least one peripheral solder-wettable portion, each inner solder-wettable portion being physically and electrically connected with an associated I/O pad with an associated solder joint, each peripheral solder-wettable portion being physically and electrically connected with an associated solder-wettable surface on a lower contact lead with an associated solder joint such that each trace electrically couples an associated I/O pad with an associated lower contact lead.
1 more element
An integrated circuit package, comprising:
- a first integrated circuit die, the die having an active surface and a back surface substantially opposite the active surface, the active surface including a plurality of I/O pads;
- a plurality of lower contact leads, each lower contact lead having a first solder-wettable surface and a second surface substantially opposite the first solder-wettable surface;
- and
- an insulating substrate having a plurality of electrically conducting upper routing traces formed on a bottom surface thereof, the bottom surface of the insulating substrate facing and covering at least substantially the entire active face of the first integrated circuit die, wherein each upper routing trace includes an inner solder-wettable portion and a peripheral solder-wettable portion, each inner solder-wettable portion being physically and electrically connected via an associated solder joint with an associated I/O pad, each peripheral solder-wettable portion being physically and electrically connected via an associated solder joint with an associated solder-wettable surface on a lower contact lead such that each upper routing trace electrically couples an associated I/O pad with an associated lower contact lead.
1 more element
Dependencies are inferred from the claim text.