Semiconductor device with parylene coating
AssigneeInfineon Technologies AG
InventorsManfred Mengel, Joachim Mahler
Life of this patent
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Abstract
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns is provided, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits. The rear side of the semiconductor wafer is provided with a coating having Parylene. The semiconductor wafer is subsequently singulated into semiconductor chips having rear sides on which the coating having Parylene is arranged.
Claims13
A semiconductor power module, comprising:
- a power substrate;
- at least one power semiconductor chip arranged on the power substrate;
- at least one driver chip having an active front side and a rear side, wherein the driver chip is mounted by the rear side onto the power substrate, and wherein the driver chip has a coating having Parylene on the rear side which electrically insulates the driver chip from the power substrate.
A semiconductor power module, comprising:
- a power substrate;
- at least one power semiconductor chip arranged on the power substrate ;
- at least one driver chip having an active front side and a rear side, wherein the rear side of the driver chip is covered with a coating including Parylene, wherein the driver chip is mounted by the rear side onto the power substrate with an adhesive, wherein the Parylene coating is separate from the adhesive and electrically insulates the driver chip from the power substrate.
Dependencies are inferred from the claim text.