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US 7,923,822 B2Granted
Integrated circuit package system including shield
AssigneeSTATS ChipPAC, Ltd.
InventorMarcos Karnezos
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.
Claims10
An integrated circuit package system comprising:
- a substrate;
- a first device attached to the substrate;
- a shield attached to the substrate and surrounding the first device, the shield having a projection over a lower side wall with an aperture between the projection and the lower side wall;
- and
- an encapsulation material through the aperture.
2 more elements
Dependencies are inferred from the claim text.