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US 7,923,816 B2Granted
Semiconductor device having capacitor element
AssigneeRenesas Electronics Corporation
InventorsKen Inoue, Tomoko Inoue
Life of this patent
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Abstract
Provided is a semiconductor device which includes a capacitor element having a flat-plate-type lower electrode provided over a semiconductor substrate, a flat-plate-type TiN film provided over the lower electrode in parallel therewith, and a capacitor film provided between the lower electrode and the TiN film; and a first Cu plug brought into contact with the bottom surface of the lower electrode, and is composed of a metal material, wherein the capacitor film has a film which contains an organic molecule as a constituent.
Claims13
A semiconductor device comprising:
- a capacitor element comprising a flat-plate-type lower electrode provided over a semiconductor substrate, a flat-plate-type upper electrode provided over said lower electrode in parallel therewith, and a capacitor film provided between said lower electrode and said upper electrode;
- a first contact plug brought into contact with the bottom surface of said lower electrode, and is composed of a metal material;
- a first impurity-diffused layer provided in the surficial portion of said semiconductor substrate;
- a gate electrode provided over said semiconductor substrate, and on the lateral side of said first impurity-diffused layer;
- a second impurity-diffused layer provided in said semiconductor substrate on the lateral side of said gate electrode, while being opposed with said first impurity-diffused layer;
- a bit line provided over said semiconductor substrate;
- and
- a second contact plug connecting said bit line and said second impurity-diffused layer, and is composed of a copper-containing metal,
- wherein said capacitor film has a film which contains an organic molecule as a constituent,
- wherein said upper electrode comprises a first and second layer,
- wherein said first contact plug is brought into contact with said first impurity-diffused layer, and is composed of a copper-containing metal,
- wherein said capacitor element is provided more closer to said substrate than said bit line is,
- wherein a first region having said capacitor element and said bit line, and a second region having a first interconnect provided over said semiconductor substrate, are provided over said semiconductor substrate, and
- said bit line and said first interconnect are provided at the same level of height,
- said first region is arranged according to a lattice pattern, and said second region is not arranged according to the lattice pattern.
12 more elements
A semiconductor device comprising:
- a capacitor element comprising a flat-plate-type lower electrode provided over a semiconductor substrate, a flat-plate-type upper electrode provided over said lower electrode in parallel therewith, and a capacitor film provided between said lower electrode and said upper electrode;
- and
- a first contact plug brought into contact with the bottom surface of said lower electrode, and is composed of a metal material,
- wherein said capacitor film has a film which contains an organic molecule as a constituent,
- wherein said upper electrode comprises a first and second layer,
- wherein a planar geometry of said upper electrode equals a planar geometry of said capacitor film,
- said planar geometry of said upper electrode is greater than the planar geometry of said lower electrode.
4 more elements
Dependencies are inferred from the claim text.