Image sensor module and fabrication method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsMin-seog Choi, Seung-wan Lee, Woon-bae Kim, Eun-sung Lee, Kyu-dong Jung, Che-heung Kim
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Abstract
An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.
Claims23
An image sensor module comprising:
- a sensor chip;
- a sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer comprising a concave surface formed on an upper part thereof by polymer molding, so that the sensor chip is bent and bonded on the concave surface;
- and
- at least one lens fixed on the sensor chip-mounting structure above the sensor chip;
- wherein the sensor chip-mounting structure further comprises a wiring part which electrically connects a surface of the concave surface and a lower part of the substrate.
A fabrication method of an image sensor module comprising:
- forming a first wafer in which a plurality of sensor chips is formed in a first arrangement;
- forming a second wafer in which a plurality of sensor chip-mounting structures having concave surfaces, is formed in a second arrangement,
- partially dicing the first wafer in a predetermined depth;
- aligning and preliminarily bonding the first wafer with the second wafer;
- and
- bonding the plurality of sensor chips of the first wafer to corresponding concave surfaces of the plurality of sensor chip-mounting structures of the second wafer by bending the plurality of sensor chips while heating the first and the second wafers.
Dependencies are inferred from the claim text.