Field effect transistor having increased carrier mobility
AssigneeGlobalfoundries Inc.
InventorsQi Xiang, Boon-Yong Ang, Jung-Suk Goo
Life of this patent
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AssigneeGlobalfoundries Inc.
InventorsQi Xiang, Boon-Yong Ang, Jung-Suk Goo
Estimating the term…
According to one exemplary embodiment, a FET which is situated over a substrate, comprises a channel situated in the substrate. The FET further comprises a first gate dielectric situated over the channel, where the first gate dielectric has a first coefficient of thermal expansion. The FET further comprises a first gate electrode situated over the first gate dielectric, where the first gate electrode has a second coefficient of thermal expansion, and where the second coefficient of thermal expansion is different than the first coefficient of thermal expansion so as to cause an increase in carrier mobility in the FET. The second coefficient of thermal expansion may be greater that the first coefficient of thermal expansion, for example. The increase in carrier mobility may be caused by, for example, a tensile strain created in the channel.
A FET situated over a substrate, said FET comprising:
A FET situated over a substrate, said FET comprising a channel situated in said substrate, a first gate dielectric situated over said channel, said first gate dielectric having a first coefficient of thermal expansion, a first gate electrode situated over said first gate dielectric, said first gate electrode having a second coefficient of thermal expansion, said FET being characterized in that:
A FET situated on a substrate, said FET comprising:
Dependencies are inferred from the claim text.