Wafer level LED package structure and method for making the same

A wafer level LED package structure, comprising:

• a light-emitting unit including a light-emitting body having a positive conducting region and a negative conducting region formed on the light-emitting body, an insulative structure formed between and electrically separating the positive conducting region and the negative conducting region;
• a first conductive unit comprising at least one first positive conductive layer formed on the positive conducting region and at least one first negative conductive layer formed on the negative conducting region of the light-emitting unit respectively;
• a second conductive unit comprising at least one second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer of the first conductive unit, the second positive conductive layer and the second negative conductive layer forming an exposed positive contact surface and an exposed negative contact surface respectively, wherein the area of the exposed positive contacted surface is substantially identical to the area of the exposed negative contact surface;
• and
• an insulative unit having an insulating layer formed on the insulative structure of the light-emitting unit between the second positive conductive layer and the second negative conductive layer, wherein the second insulative layer is separated from the second positive conductive layer by a predetermined distance defining a first gap there-between, and wherein the second insulative layer is separated from the second negative conductive layer by a predetermined distance defining a second gap there-between.