Light emitting diode package structure and method for fabricating the same
AssigneeIndustrial Technology Research Institute
InventorsYao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Abstract
The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
Claims13
A light emitting diode (LED) package structure, comprising:
- a carrier;
- a first protrusion on the carrier and having a first opening to expose the carrier, and the first protrusion comprising a thermal conductive material;
- a LED chip disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip being larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the first opening;
- and
- an adhesion layer disposed between the LED chip and the carrier to bond the LED chip to the carrier.
A light emitting diode (LED) package structure, comprising:
- a carrier;
- a first protrusion on the carrier and having a first opening to expose the carrier, and the first protrusion comprising a thermal conductive material;
- a LED chip disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip being between 1 and 1.5;
- and
- an adhesion layer disposed between the LED chip and the carrier to bond the LED chip to the carrier.
Dependencies are inferred from the claim text.