Semiconductor light-emitting device
AssigneeHuga Optotech Inc.
InventorsTzong-Liang Tsai, Wei-Kai Wang, Su-Hui Lin, Yi-Cun Lu
Life of this patent
Estimating the term…
Loading patent…
AssigneeHuga Optotech Inc.
InventorsTzong-Liang Tsai, Wei-Kai Wang, Su-Hui Lin, Yi-Cun Lu
Estimating the term…
The invention discloses a semiconductor light-emitting device, which includes a substrate, a first conductive type semiconductor material layer, a second conductive type semiconductor material layer, a light-emitting layer, a first electrode, a second electrode, and a plurality of bump structures. The first conductive type semiconductor material layer is formed on the substrate and has an upper surface which includes a first region and a second region distinct from the first region. The first electrode is formed on the first region. The light-emitting layer and the second conductive type semiconductor material layer are formed on the second region. The bump structures are formed on the upper surface of the first conductive type semiconductor material layer and between the first region and the second region. At least one recess is formed in the sidewall of each bump structure. Alternatively, the sidewall of each bump structure has a curved contour.
A semiconductor light-emitting device, comprising:
A semiconductor light-emitting device, comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
1. Field of the Invention
This invention relates to a semiconductor light-emitting device and, more particularly, to a semiconductor light-emitting device which has high light-extraction efficiency.
2. Description of the Prior Art
FIG. 1 is a schematic diagram illustrating a light-emitting diode of prior arts.
FIG. 2A is a cross-sectional view illustrating a semiconductor light-emitting device according to an embodiment of the invention.
FIG. 2B is a cross-sectional view illustrating another semiconductor light-emitting device according to an embodiment of the invention.
Please refer to FIG. 2A. FIG. 2A is a cross-sectional view illustrating a semiconductor light-emitting device 2 according to an embodiment of the invention.
As shown in FIG. 2A, the semiconductor light-emitting device 2 includes a substrate 20, a first conductive type semiconductor material layer 22, a light-emitting layer 24, a second conductive type semiconductor material layer 26, a first electrode 30, a second electrode 32, and a plurality of bump structures 28.
In a practical application, the substrate 20 can be, but not limited to, glass, silicon, Ge, GaN, GaAs, GaP, AlN, sapphire, spinnel, Al2O3, SiC, ZnO, MgO, LiAlO2, LiGaO2 and MgAlO4.
Constructional details: coatings, e.g. passivation layers or antireflective coatings
Bodies: characterised by their shape, e.g. curved or truncated substrates
Constructional details: scattering means
Inorganic light-emitting semiconductor devices having potential barriers
About 1 year 9 months of term left · ends 1 Aug 2028 (estimated)