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AssigneeHitachi High-Technologies Corporation
InventorsHidetoshi Morokuma, Akiyuki Sugiyama, Ryoichi Matsuoka, Takumichi Sutani, Yasutaka Toyoda
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One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.
In a method of measuring a pattern by specifying the position of a pattern edge of an inspection objective pattern by using a signal waveform acquired by scanning a charged-particle beam on a sample so as to measure a distance between design data of said inspection objective pattern and said pattern edge,
In a method of measuring a pattern by specifying the position of a pattern edge of an inspection objective pattern by using a signal waveform acquired by scanning a charged-particle beam on a sample so as to measure a distance between design data of said inspection objective pattern and said pattern edge,
In a method of measuring a pattern by specifying the position of a pattern edge of an inspection objective pattern by using a signal waveform acquired by scanning a charged-particle beam on a sample so as to measure a distance between design data of said inspection objective pattern and said pattern edge,
An arithmetic unit for measuring the dimension of a pattern on a sample on the basis of an image obtained under scanning a charged-particle beam emitted from a charged-particle source on said sample, wherein said arithmetic apparatus calculates a direction of a pattern edge formed on said sample and a relative angle the scanning direction of said charged-particle beam makes to the edge direction of the pattern, a signal waveform detected from said pattern edge is corrected on the basis of a distortion corresponding to the calculated relative angle and the dimension of said pattern is measured on the basis of the corrected signal waveform.
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