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US 7,923,680 B2Granted
Analysis method and analysis apparatus
AssigneeTokyo Electron Limited
InventorsKazuya Dobashi, Shigeru Kawamura, Kohei Tsugita, Teruyuki Hayashi
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Abstract
An analysis apparatus includes a first process part for removing a film formed on a substrate by irradiating the film with ultraviolet light, a second process part for providing a solution onto a surface of the substrate for dissolving an object being analyzed on the substrate, and a third process part for analyzing the object being analyzed in the solution that is used in the second step.
Claims12
A method for analyzing an object on a substrate comprising:
- a first step of removing a film formed on the substrate by irradiating the film with ultraviolet light,
- a second step of providing a solution onto a surface of the substrate from which the film is removed, for dissolving an object being analyzed sticking on the substrate, and
- a third step of analyzing the object being analyzed in the solution that is used in the second step.
An analysis apparatus, comprising:
- a first process part for removing a film formed on a substrate by irradiating the film with ultraviolet light,
- a second process part for providing a solution onto a surface of the substrate from which the film is removed, for dissolving an object being analyzed sticking on the substrate, and
- a third process part for analyzing the object being analyzed in the solution that is used in the second part.
Dependencies are inferred from the claim text.