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US 7,923,658 B2Granted
Laser micromachining methods and systems
AssigneeHewlett-Packard Development Company, L.P.
InventorsMark Huth, Philip G Rourke, Craig M. Gates
Life of this patent
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Abstract
A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.
Claims31
A method comprising:
- forming a feature in a substrate to a first depth by supplying a liquid to at least an area substantially encompassing the feature while applying laser energy along the first substrate surface, such that some of the liquid remains within the feature;
- ceasing supply of the liquid when the feature has the first depth within the substrate, such that at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy;
- and
- forming the feature to a second depth that is greater than the first depth by continuing to apply the laser energy along the first substrate surface such that no liquid is applied during formation of the feature from the first depth to the second depth,
- wherein the first depth is at least approximately ninety percent the thickness of the substrate between a first substrate surface and a second substrate surface that substantially opposes the first substrate surface.
2 more elements
A method of laser micromachining a substrate comprising:
- forming a feature into a substrate, at least in part, by directing laser energy at the substrate;
- and,
- during a predetermined portion of said forming, supplying liquid to at least a first region of the feature and ceasing supply of the liquid after the predetermined portion of said forming has occurred,
- wherein some of the liquid remains within the feature while the feature is formed during the predetermined portion of said forming in which the liquid is supplied while the laser energy is directed at the substrate, such that upon ceasing supply of the liquid after the predetermined portion of said forming has occurred, at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy.
1 more element
A method comprising:
- directing laser energy at a substrate to remove substrate material;
- and,
- during a predetermined duration of directing laser energy, selectively delivering liquid to the substrate and ceasing supply of the liquid after the predetermined duration has occurred,
- wherein some of the liquid remains within the feature while the feature is formed during the predetermined duration in which the liquid is supplied while the laser energy is directed at the substrate, such that upon ceasing supply of the liquid after the predetermined duration has occurred, at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy, and
- wherein the predetermined duration comprises at least half of the time the laser energy is directed at the substrate to form the feature.
2 more elements
A system for defining a fluid path through a substrate, the fluid path being defined between a first surface and a second surface of the substrate, the system comprising:
- a laser source that defines a feature in the first surface;
- a liquid supply apparatus that supplies liquid to at least an area substantially encompassing the feature;
- and,
- means for instructing the liquid supply apparatus to cease supply of the liquid based upon a status of the feature during formation of the feature, wherein prior to ceasing the supply of the liquid, some of the liquid remains within the feature during formation of the feature, such that thereafter the laser source is further to evaporate at least substantially all of the liquid remaining within the feature.
1 more element
A computer readable medium including instruction for operating a computer that controls a laser source, the instructions comprising:
- instructions for forming a feature in a substrate to a first depth by supplying a liquid to at least an area substantially encompassing the feature while applying laser energy along the first substrate surface, such that some of the liquid remains within the feature;
- instructions for ceasing supply of the liquid when the feature has the first depth within the substrate, such that at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy;
- and
- instructions for forming the feature to a second depth that is greater than the first depth by continuing to applying the laser energy along the first substrate surface such that no liquid is applied during formation of the feature from the first depth to the second depth,
- wherein the first depth is at least approximately eight percent the thickness of the substrate between a first substrate surface and a second substrate surface that substantially opposes the first substrate surface.
2 more elements
A computer readable medium including instruction for operating a computer that controls a laser source, the instructions comprising:
- instructions for forming a feature into a substrate, at least in part, by directing laser energy at the substrate;
- and,
- instructions for during a predetermined portion of said forming, supplying liquid to at least a first region of the feature and for ceasing supply of the liquid after the predetermined portion of said forming has occurred,
- wherein some of the liquid remains within the feature while the feature is formed during the predetermined portion of said forming in which the liquid is supplied while the laser energy is directed at the substrate, such that upon ceasing supply of the liquid after the predetermined portion of said forming has occurred, at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy.
1 more element
A computer readable medium including instruction for operating a computer that controls a laser source, the instructions comprising:
- instructions for directing laser energy at a substrate to remove substrate material;
- and,
- instructions for during a predetermined duration of directing laser energy, selectively delivering liquid to the substrate and for ceasing supply of the liquid after the predetermined duration has occurred,
- wherein some of the liquid remains within the feature while the feature is formed during the predetermined duration in which the liquid is supplied while the laser energy is directed at the substrate, such that upon ceasing supply of the liquid after the predetermined duration has occurred, at least substantially all of the liquid remaining within the feature is evaporated by continuing application of the laser energy, and
- wherein the predetermined duration comprises at least half of the time the laser energy is directed at the substrate to form the feature.
2 more elements
Dependencies are inferred from the claim text.