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US 7,923,393 B2Granted
Low melting point frit paste composition and sealing method for electric element using the same
AssigneeDongjin Semichem Co., Ltd.
InventorsJung-Hyun Son, Sang-Kyu Lee, Han-Bok Joo
Life of this patent
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Abstract
The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.
Claims11
A low melting point frit paste composition, comprising:
- a) frit powder having P2O5 of 0.1 to 25 mol %, V2O5 of 0.1 to 50 mol %, ZnO of 0.1 to 20 mol %, BaO of 0.1 to 15 mol %, Sb2O3 of 0.1 to 10 mol %, Fe2O3 of 0.1 to 15 mol %, Al2O3 of 0.1 to 5 mol %, B2O3 of 0.1 to 5 mol %, Bi2O3 of 0.1 to 10 mol % and TiO2 of 0.1 to 5 mol%;
- b) a filler;
- c) an organic binder which has a number average molecular weight of 50,000 to 100,000 g/mole and a viscosity of 500 to 2,000 cp if being melted in 5 wt% by butylcarbitolacetate;
- and
- d) an organic solvent.
2 more elements
Dependencies are inferred from the claim text.