Junction formation on wafer substrates using group IV nanoparticles

A method of forming a diffusion region, comprising:

• coating the surface of a wafer with a spacer layer, before the depositing of the nanoparticle ink;
• depositing a nanoparticle ink on a surface of the wafer to form a non-densified film, the nanoparticle ink having set of nanoparticles, wherein at least some nanoparticles of the set of nanoparticles include dopant atoms therein;
• heating the non-densified film to a first temperature and for a first time period to remove a solvent from the deposited nanoparticle ink;
• heating the non-densified film to a second temperature and for a second time period to form a densified film, wherein at least some of the dopant atoms diffuse into the wafer to form the diffusion region;
• and,
• removing the densified film and the spacer layer, after heating the non-densified thin film to a second temperature and for a second time period.