Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

A method for manufacturing a multilayer wiring substrate mounted with an electronic component, comprising:

• preparing a plate-like core material layer having a wiring and a first opening, the wiring including a plurality of connection conductor sections formed around the first opening on one surface of the core material layer;
• forming, on the one surface of the core material layer, a resin layer having a second opening which is greater than the first opening in such a way that the plurality of connection conductor sections are exposed within the second opening;
• bonding a supporting layer to the other surface of the core material layer, wherein a copper foil is used as the supporting layer;
• mounting the electronic component on a surface of the supporting layer within the first opening;
• electrically connecting the electronic component to the plurality of connection conductor sections by means of bonding wires;
• filling the first and second openings with a resin in order to seal the electronic component and the bonding wires;
• removing all of the copper foil;
• and
• forming an insulating resin layer on both surfaces of the substrate after removal of all of the copper foil.

A method for manufacturing a multilayer wiring substrate mounted with an electronic component, comprising:

• preparing a plate-like core material layer having a wiring and a first opening, the wiring including a plurality of connection conductor sections formed around the first opening on one surface of the core material layer;
• forming, on the one surface of the core material layer, a resin layer having a second opening which is greater than the first opening in such a way that the plurality of connection conductor sections are exposed within the second opening;
• bonding a supporting layer to the other surface of the core material layer, wherein a copper foil is used as the supporting layer;
• mounting the electronic component on a surface of the supporting layer within the first opening;
• electrically connecting the electronic component to the plurality of connection conductor sections by means of bonding wires;
• filling the first and second openings with a resin in order to seal the electronic component and the bonding wires;
• removing the copper foil;
• and
• forming an insulating resin layer on both surfaces of the substrate after removal of the copper foil,
• wherein, in the step of removing the copper foil, only the copper foil located at areas where the electronic component is mounted is left, and
• wherein, in the step of forming the insulating resin layer, openings are formed in the insulating resin layer such that the remaining copper foil becomes partially exposed to thus form a heat radiation section.