Method for manufacturing a metal-semiconductor contact in semiconductor components

A method for manufacturing a metal-semiconductor contact, the method comprising:

• providing a semiconductor component having an upper surface;
• applying a layer system comprising at least one insulation layer and at least one electrically conductive layer onto the upper surface of the semiconductor component such that a first contact area and a second contact area of a schottky diode are formed, the first contact area being electrically insulated from the second contact area, the first contact area and the second contact area being electrically connected to the semiconductor component;
• etching a first window between the first contact area and the second contact area such that the at least one insulation layer remains between the first contact area and the second contact area, the first window being etched in a first mask process;
• etching a second window within the first window such that the second window is smaller than the first window and such that a portion of the remaining insulation layer on the upper surface of the semiconductor component is removed so that the upper surface of the semiconductor component is exposed, the second window being etched in a second mask process;
• and
• applying a metal directly into the second window such that the metal directly contacts the upper surface of semiconductor component thereby forming a third contact area and thereby forming the metal-semiconductor contact.