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US 7,923,355 B2Granted
Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device
AssigneeNuFlare Technology, Inc.
InventorsMasayoshi Yajima, Yoshikazu Moriyama
Life of this patent
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Abstract
A manufacturing method for a semiconductor device includes retaining a wafer in a reaction chamber, supplying first process gas including source gas and second process gas containing H2 or inert gas onto the wafer in a rectified state alternately in a predetermined cycle, rotating the wafer, and heating the wafer to form a film on the wafer.
Claims20
A manufacturing method for a semiconductor device, comprising:
- retaining a wafer in a reaction chamber;
- supplying a first process gas including source gas and a second process gas containing at least one of H2 and inert gas excluding source gas and cleaning gas onto the wafer in a rectified state perpendicular to the wafer surface, switching back and forth between the first process gas and the second process gas in a predetermined period, and supplying cleaning gas onto an outer periphery of the wafer concurrently with the supply of the first process gas or the second process gas;
- rotating the wafer;
- and
- heating the wafer to form a film on the wafer.
2 more elements
A manufacturing apparatus for a semiconductor device for forming a film on a wafer, comprising:
- a reaction chamber to load the wafer;
- a first gas supply mechanism configured to supply a first process gas including source gas and a second process gas containing at least one of H2 and inert gas excluding source gas and cleaning gas in the reaction chamber;
- a first gas control mechanism configured to control switching back and forth between the first process gas and the second process gas to be alternately supplied;
- a first rectifying plate to supply the first process gas or the second process gas supplied from the first gas supply mechanism onto the wafer in a rectified state perpendicular to the wafer surface;
- a gas discharge mechanism to discharge the gas from the reaction chamber;
- a retention mechanism to retain the wafer at a predetermined position in the reaction chamber;
- and
- a heater to heat the wafer.
5 more elements
Dependencies are inferred from the claim text.