Method of resin sealing electronic part
AssigneeFujitsu Semiconductor Limited
InventorsYoshito Akutagawa, Izumi Kobayashi, Naoyuki Watanabe, Susumu Moriya, Toshiyuki Honda, Noboru Hayasaka
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Abstract
A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.
Claims6
A method of resin sealing an electronic part, comprising:
- forming, with a mold member, resin material into a shape that includes a concave part having a volume corresponding to a volume of the electronic part, the concave part having a location corresponding to a mounting position of the electronic part;
- solidifying, with the mold member, the resin material;
- removing the solid resin material from the mold member;
- placing the solid resin material into a cavity forming part of a lower mold;
- providing, in an upper mold, a board including one or more mounted electronic parts;
- melting the solid resin material placed in the cavity forming part of the lower mold;
- and
- dipping the one or more electronic parts into the molten resin so that the resin sealing is achieved.
A method of resin sealing an electronic part, comprising:
- providing, in an upper mold, a board including one or more mounted electronic parts;
- selectively projecting, based on the presence of a mounted electronic part, a projection part having a volume corresponding to the volume of the mounted electronic part into a cavity forming part of a lower mold;
- melting a resin material received in the cavity forming part of the lower mold;
- dipping the one or more electronic parts into the molten resin so that the resin sealing is achieved;
- and
- reducing, corresponding to the dipping of the one or more electronic parts into the molten resin, a projection amount of the projection part.
Dependencies are inferred from the claim text.