Back to results
US 7,923,300 B2Granted
Stacked power converter structure and method
AssigneeIntersil Americas Inc.
InventorsDavid B. Bell, Francois Hebert, Nikhil Kelkar
Life of this patent
Estimating the term…
Abstract
A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.
Claims6
A method for forming a power converter, comprising:
- providing a first semiconductor die comprising a high-side power output switch and a low-side power output switch;
- forming a first conductive layer portion over the high-side power output switch which electrically couples with a drain of the high-side power output switch and with device voltage in (VIN);
- forming a second conductive layer portion over the low-side power output switch which electrically couples with a source of the low-side power output switch and with device ground (PGND);
- attaching the first semiconductor die to a die pad;
- and
- attaching a second semiconductor die comprising controller circuitry over the first semiconductor die, such that the first semiconductor die is interposed between the second semiconductor die and the die pad.
3 more elements
Dependencies are inferred from the claim text.