Imager die package and methods of packaging an imager die on a temporary carrier

A method of packaging an imager die, comprising:

• dicing through a thickness of a fabrication substrate between adjacent imager die of a plurality of imager dice carried by the fabrication substrate to form a plurality of individual imager die;
• securing a plurality of known good imager die qualified from the plurality of individual imager die to a temporary carrier;
• encapsulating at least partially the plurality of known good imager die on the temporary carrier to form a reconstructed wafer;
• and
• singulating the at least partially encapsulated plurality of known good imager die from the reconstructed wafer.

A method of packaging an imager die, comprising:

• attaching at least one optical element over an active surface of a wafer including a plurality of imager dice, each imager die positioned on the active surface;
• dicing the wafer between adjacent imager die resulting in a plurality of individual imager die;
• securing at least one imager die of the plurality of individual imager die to a temporary carrier;
• forming a reconstructed wafer by at least partially encapsulating the at least one imager die on the temporary carrier;
• and
• singulating the at least partially encapsulated at least one imager die from the reconstructed wafer.