Board on chip package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyun-soo Chung, Dong-hyeon Jang, Dong-ho Lee, In-young Lee
Life of this patent
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Abstract
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening.
Claims6
A method of manufacturing a package, comprising:
- providing a wafer having a surface on which a plurality of integrated circuit chips having an active surface supporting a plurality of contact pads are provided;
- adhering an interposer to the active surface of the integrated circuit chips provided on the surface of the wafer, the interposer being provided with at least one hole through which the contact pads are exposed;
- cutting the wafer to separate the integrated circuit chips;
- adhering a board to the interposer on each integrated circuit chip, the board being provided with an opening through which the contact pads are exposed;
- and
- bonding the boards to the contact pads of the integrated circuit chips using bonding wires.
Dependencies are inferred from the claim text.