Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween

A method for manufacturing a semiconductor device, comprising the steps of:

• providing an electronic component to a second substrate;
• bonding a second insulation film to the second substrate with an adhesive;
• forming a wiring line electrically coupling an electrode of the electronic component and a terminal of the second substrate by coating a liquid material containing a conductive material,
• wherein the electronic component includes:
• at least a first insulation film,
• a second insulation film, and
• the electrode, wherein the electrode includes a first portion and a second portion, the first portion being disposed between the first insulation film and the second insulation film, and the second portion being exposed by the second insulation film,
• forming a first portion of the wiring line between the electrode and the second substrate such that the first portion of the wiring line contacts opposing surfaces of the second substrate and the electrode;
• and
• forming a second portion of the wiring line between the first insulation film and the second substrate such that the second portion of the wiring line contacts opposing surfaces of the first insulation film and the second substrate;
• wherein the wiring line is formed by filing a cavity that is formed between the second portion and the second substrate with the liquid material.