Method of fabricating electronic device having stacked chips
AssigneeSamsung Electronics Co., Ltd.
InventorsHae-Jung Yu, Eun-Chul Ahn, Tae-Gyeong Chung, Nam-Seog Kim
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Abstract
A method of fabricating an electronic device having stacked chips is provided. The method includes forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction. A molding layer is formed between the chips. Grooves are formed in the molding layer between the chips arranged in the row direction. Conductive interconnections are formed on the substrate having the grooves. The substrate is sawn along an odd- or even-numbered one of the grooves to be separated into a plurality of unit substrates. At least one of the separated unit substrates is folded along an unsawn groove of the grooves.
Claims19
A method of fabricating an electronic device, comprising:
- forming first and second chips spaced apart from each other on a substrate;
- forming interconnections electrically connecting the first and second chips;
- folding the substrate between the first and second chips;
- forming a molding layer between the first and second chips before forming the interconnections;
- and
- forming a groove between the first and second chips before forming the interconnections.
A method of fabricating an electronic device, comprising:
- forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction on a substrate;
- forming a molding layer between the at least one of the plurality of chips arranged in the row direction and the at least one chip arranged in the column direction;
- forming grooves in the molding layer between the plurality of chips arranged in the row direction, respectively;
- forming conductive interconnections on portions of the substrate having the grooves;
- sawing the substrate along at least one of an odd-numbered and even-numbered groove of the grooves to separate the substrate into a plurality of unit substrates;
- and
- folding at least one of the separated unit substrates along an unsawn groove of the grooves, where the unsawn groove is not sawed.
A method of fabricating an electronic device, comprising:
- forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction on a substrate;
- forming a molding layer between the plurality of chips and the at least one chip;
- forming grooves in the molding layer between the plurality of chips arranged in the row direction;
- forming interconnections crossing one first groove of the grooves and electrically connecting the plurality of chips adjacent to the first groove;
- sawing the substrate along the first groove to form unit substrates;
- adhering bottom surfaces of the sawn unit substrates;
- and
- forming at least one conductive structure electrically connecting interconnections on at least one sidewall of the adhered unit substrates.
Dependencies are inferred from the claim text.