Integrated circuit packaging system having dual sided connection and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• mounting a flip chip integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via and to the substrate;
• attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit;
• providing a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via;
• mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via includes electrically coupling the pre-attached interconnect and the device through via;
• forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer;
• and
• connecting a mounting device to the device through via.

An integrated circuit packaging system comprising:

• a substrate;
• an integrated circuit, having a device through via and a device interconnect, over the substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via and to the substrate;
• a conductive support over the substrate with the conductive support adjacent to the integrated circuit;
• a pre-formed interposer, having an interposer through via, active circuitry, and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via including:
• the pre-formed interposer having the characteristics of the pre-attached interconnect pre-attached to a carrier of the pre-formed interposer, and
• the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via;
• an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer with the encapsulation coplanar with the exposed portion of the pre-formed interposer;
• and
• a mounting device connected to the device through via.