Millisecond annealing (DSA) edge protection
AssigneeApplied Materials, Inc.
InventorsBlake Koelmel, Robert C. McIntosh, David D L Larmagnac, Alexander N. Lerner, Abhilash J. Mayur, Joseph Yudovsky
Life of this patent
Estimating the term…
Abstract
A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate.
Claims9
A method of thermally processing a substrate in a processing chamber, comprising:
- positioning the substrate on a substrate support in the processing chamber;
- directing electromagnetic energy toward the substrate;
- and
- positioning an energy blocker to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the positioning an energy blocker comprises using alignment points to align the energy blocker with the substrate support.
A method of thermally processing a substrate in a processing chamber, comprising:
- positioning the substrate on a substrate support in the processing chamber;
- directing electromagnetic energy toward the substrate;
- engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy;
- exposing the center of the substrate to electromagnetic radiation;
- then
- disengaging the energy blocker and the substrate support;
- and then
- removing the substrate from the processing chamber.
A method of thermally processing a substrate in a processing chamber, comprising:
- positioning the substrate on a substrate support in the processing chamber;
- directing electromagnetic energy toward the substrate;
- engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the energy blocker comprises alumina, aluminum nitride, quartz, or silicon carbide.
A method of thermally processing a substrate in a processing chamber, comprising:
- positioning the substrate on a substrate support in the processing chamber;
- directing electromagnetic energy toward the substrate;
- engaging an energy blocker and the substrate support, the energy blocker configured to block at least a portion of the electromagnetic energy from striking an edge of the substrate while exposing the center of the substrate to the electromagnetic energy, wherein the engaging an energy blocker and the substrate support further comprises inserting a pin coupled to the substrate support into a recess within the energy blocker to align the energy blocker with the substrate support.
Dependencies are inferred from the claim text.