Method of assembling multi-layer LED array engine

A method of making a multilayer light emitting diode (LED) array engine, comprising:

• preparing a base plate frame comprising at least one lighting area, and two lead frame grooves, wherein the lighting area is located at a center of the base plate frame, and the two lead frame grooves are positioned at a front side and a rear side of the base plate frame, wherein the base plate frame further comprises at least one first locking hole and at least one through hole at each of a left side and a right side of the base plate frame, and at least two dented grooves corresponding to each of the two lead frame grooves;
• positioning two lead frames inside accommodating spaces defined in the two lead frame grooves, respectively, wherein each lead frame groove comprises an inner connection portion positioned adjacent to the lighting area and an outer connection portion positioned relatively apart from the lighting area, wherein the outer connection portion protrudes exceeding a peripheral edge of the base plate frame and each lead frame groove comprises at least one second locking hole and at least one second lock-in groove between the inner connection portion and the outer connection portion;
• executing an injection molding process to form a molded platform on the base plate frame, wherein the molded platform surrounds the lighting area, and fills up the first locking holes, and the molded platform is positioned between the lighting area and the through holes, wherein the molded platform sequentially buries the dented grooves, fills up the lead frame grooves, and covers the lead frames, wherein the molded platform does not cover the upper side of the inner connection region and the periphery of the outer connection region, wherein a portion of the molded platform located above the lighting area is defined as an upper molded platform, and the upper molded platform comprises an inner sidewall, on which an optical reflectivity surface is configured, a dome embedding groove configured at a top portion of the upper molded platform and positioned above the optical reflectivity surface, and a phosphorous wall positioned beneath the inner wall of the upper molded platform;
• arranging a plurality of LED dice in an array form on an upper surface of the base plate frame;
• electrically coupling the LED dice to the lead frames by bonded wires to form a circuit;
• forming a protection layer on the LED dice and the bonded wires;
• forming a phosphorous layer on the protection layer, wherein the phosphorous layer is formed by providing a phosphorous compound within a range defined by the phosphorous wall;
• and
• forming a dome on the upper surface of the molded platform by executing an injection molding process, wherein a bottom of the dome completely fills up the dome embedding groove.