Photosensitive dielectric paste and electronic part made with the same

Abstract

Provided is a photosensitive dielectric paste capable of being burned at a low temperature in a short time and forming a dielectric film (insulator film) having favorable properties, such as sintering properties or temperature characteristics of dielectric constant, and an electronic part having favorable properties having a dielectric film formed using the same. The photosensitive dielectric paste of the invention contains (a) an inorganic ingredient containing 10 to 30% by volume of dielectric powder containing a Ba—Nd—Ti complex oxide powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi in a proportion of 50 to 90% by weight in terms of Bi2O3; and (b) a photosensitive organic ingredient, in which the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide. As the supporting glass powder, a glass powder containing Si in a proportion of 70 to 90% by weight in terms of SiO2 is used.

Dependencies are inferred from the claim text.