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US 7,923,125 B2Granted
Apparatus for solder crack deflection
AssigneeIntel Corporation
InventorsChung C. Key, Mustapha Mohd. Faizul, Tan Siew Sang
Life of this patent
Estimating the term…
Abstract
An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
Claims17
An apparatus comprising:
- a first component defining an interior of the apparatus;
- a first dome shaped solder composition exterior to and physically touching the first component;
- a second different solder composition exterior to the first solder composition and the first component;
- and
- a second component exterior to the second solder composition, the first solder composition, and the first component, wherein the second different solder composition is physically touching the first solder composition, the first component, and the second component, and wherein the first solder composition has a higher melting point than the second solder composition, wherein the first solder composition defines a dome shape having a height of about 0.1 to about 0.2 times a total height of the first solder composition and the second solder composition.
2 more elements
An apparatus comprising:
- a first component;
- a first dome shaped solder composition attached to and physically touching a surface of the first component;
- a second different solder composition adjacent to, overlaying, and completely enclosing the first solder composition, wherein the second solder composition is attached to the first solder composition and the first component;
- and
- a second component attached to the second solder composition, wherein the first and second solder compositions form a laminate connection structure between the first component and the second component, wherein the first solder composition has a higher melting point than the second solder composition, wherein the first solder composition defines a dome shape having a height of about 0.1 to about 0.2 times a total height of the first solder composition and the second solder composition.
2 more elements
Dependencies are inferred from the claim text.