Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
AssigneeCabot Microelectronics Corporation
InventorsSelvaraj Palanisamy Chinnathambi, Ping-Ha Yeung, Brian Reiss
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Abstract
The invention provides a chemical-mechanical polishing composition consisting essentially of flumed alumina, alpha alumina, silica, a nonionic surfactant, an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid, hydrogen peroxide, and water. The invention further provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
Claims22
A chemical-mechanical polishing composition consisting essentially of:
- (a) about 0.2 to about 1 wt. % of fumed alumina,
- (b) about 0.1 to about 1 wt. % of alpha alumina,
- (c) about 0.1 to about 4 wt. % of silica,
- (d) about 10 to about 1000 ppm of a nonionic surfactant,
- (e) at least 0.8 wt. % to about 1.5 wt. % of an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid,
- (f) hydrogen peroxide,
- (g) optionally a biocide, and
- (h) water.
A method of chemically-mechanically polishing a substrate comprising:
- (i) contacting a substrate with a polishing pad and a chemical-mechanical polishing composition consisting essentially of:
- (a) about 0.2 to about 1 wt. % of fumed alumina,
- (b) about 0.1 to about 1 wt. % of alpha alumina,
- (c) about 0.1 to about 4 wt. % of silica,
- (d) about 10 to about 1000 ppm of a nonionic surfactant,
- (e) at least 0.8 wt. % to about 1.5 wt. % of an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid,
- (f) hydrogen peroxide,
- (g) optionally a biocide, and
- (h) water,
- (ii) moving the polishing pad and the polishing composition relative to the substrate, and
- (iii) abrading at least a portion of the substrate to polish the substrate.
A chemical-mechanical polishing composition consisting essentially of:
- (a) about 0.2 to about 1 wt. % of fumed alumina,
- (b) about 0.1 to about 1 wt. % of alpha alumina,
- (c) about 0.1 to about 4 wt. % of silica,
- (d) about 10 to about 1000 ppm of a nonionic surfactant,
- (e) at least 0.8 wt. % to about 1.5 wt. % of alanine,
- (f) hydrogen peroxide,
- (g) optionally a biocide, and
- (h) water.
Dependencies are inferred from the claim text.