Method and device for removing layers in some areas of glass plates

A process for removing a coating from coated substrates, while preparing the substrates for subsequent uses in which a surface of the substrate that has been at least partially freed of coating is required, comprising:

• adjusting a plurality of nozzles arranged in a row from one orientation to another orientation to set the direction of elongation of the plurality of nozzles to a certain orientation direction on the surface of the substrate;
• directing a plasma onto a region of the substrate from which a coating is to be removed using the plurality of nozzles arranged in a row and set to the certain orientation, to locally remove the coating, wherein the plasma has an effective width/area determined by number and/or shape of the nozzles;
• producing a relative movement between the plasma and the substrate, parallel to the edge of the substrate;
• pivoting the row of nozzles about an axis perpendicular to the substrate in the region of a corner of the substrate;
• producing a relative movement between the plasma and the substrate, parallel to another edge of the substrate;
• and
• controlling the plasma to remove the coating to a desired depth.

A process for removing a coating from coated substrates, while preparing the substrates for subsequent uses in which a surface of the substrate that has been at least partially freed of coating is required, comprising the steps of:

• adjusting a one slit shaped nozzle from one orientation to another orientation to set the direction of elongation of the slit to a certain orientation direction on the surface of the substrate;
• directing a plasma onto a region of the substrate from which a coating is to be removed using the slit shaped nozzle set at a certain rotational angle about an axis of rotation perpendicular to the substrate, to locally remove the coating;
• producing a relative movement between the plasma and the substrate, parallel to a first edge of the substrate, wherein a width of the removed coating in a direction perpendicular to the direction parallel to the first edge of the substrate corresponds to the width of the slit shaped nozzle in the direction perpendicular to the direction parallel to the first edge of the substrate;
• pivoting the slit shaped nozzle to another rotational angle about the axis of rotation that is perpendicular to the substrate in the region of a corner of the substrate where the first edge of the substrate joins another edge of the substrate;
• producing a relative movement between the plasma and the substrate, parallel to the another edge of the substrate, wherein a width of the removed coating in a direction perpendicular to the direction parallel to the another edge of the substrate corresponds to the width of the slit shaped nozzle in the direction perpendicular to the direction parallel to the another edge of the substrate;
• and
• controlling the plasma to remove the coating to a desired depth.