Method and apparatus for plating a semiconductor package
AssigneeUTAC Thai Limited
InventorsChalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
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Abstract
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
Claims8
An apparatus for plating a plurality of semiconductor devices comprising:
- a container for holding a plating chemical;
- an electrical power source connected to an anode terminal and a cathode terminal;
- a container for holding plating particles connected to said anode terminal;
- a non-conductive platform for holding said plurality of semiconductor devices;
- and
- movable conductive parts that electrically connect surfaces of said semiconductor devices to be plated to said cathode terminal.
An apparatus for plating a plurality of semiconductor devices comprising:
- a container for holding a plating chemical;
- an electrical power source connected to an anode terminal and a cathode terminal;
- a container for holding plating particles connected to said anode terminal;
- a movable non-conductive platform for holding said plurality of semiconductor devices;
- and
- conductive parts that electrically connect surfaces of said semiconductor devices to be plated to said cathode terminal.
Dependencies are inferred from the claim text.