Vertically stackable sockets for chip modules
AssigneeSony Ericcson Mobile Communications AB
InventorsRandolph Cary Demuynck, David Ryan Story, Walter M. Marcinkiewicz
Life of this patent
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Abstract
The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules.
Claims16
A socket system for electronic devices, said socket system comprising:
- a first socket mountable on a substrate, said first socket including a first opening therein to receive a first chip module;
- a second socket stackable on said first socket, said second socket including a second opening therein to receive a second chip module;
- a first set of embedded contacts in said first socket to electrically connect said first chip module to said substrate;
- a second set of embedded contacts in said first socket to electrically connect said second socket to said substrate;
- a third set of embedded contacts in said second socket to electrically connect said second chip module to said substrate;
- wherein said first socket further includes a frame surrounding said first opening and a series of first projections that extend from said frame into said first opening for mating with complementary projections on said first chip module.
The socket system of 4 wherein said retention members comprise pins that extend into corresponding pin holes in said first and second sockets.
Dependencies are inferred from the claim text.