Substrate earthing mechanism for use in charged-particle beam writing apparatus
AssigneeNuFlare Technology, Inc.
InventorsYoshiro Yamanaka, Hideo Saito, Mitsunori Hayashi
Life of this patent
Estimating the term…
Abstract
A substrate earthing mechanism includes a plate-like spring extending toward a substrate in a direction parallel to a surface of the substrate, and a contact portion coupled to a tip end of the plate-like spring for coming into contact with the substrate to thereby provide electrical conduction therebetween. The plate spring and the contact portion are laid out so that a contact position at which the contact portion is in contact with the substrate and a layout position of the plate-like spring are substantially the same in position as each other in a direction at right angles to the substrate surface in the state that the plate spring is out of its elastic deformation.
Claims11
A mechanism for coupling a substrate to ground potential, comprising:
- a plate-like spring extending toward the substrate in a direction parallel to a surface of the substrate;
- and
- a contact portion coupled to a tip end of the plate-like spring for coming into contact with the substrate to thereby provide electrical conduction therebetween, wherein
- said plate-like spring and said contact portion are disposed such that a contact position at which said contact portion is in contact with the substrate and a layout position of said plate-like spring are substantially the same in a direction at right angles to the substrate surface in a state that said plate-like spring is out of its elastic deformation;
- wherein
- said contact portion is substantially centrally disposed in a width direction of said plate-like spring.
A charged-particle beam writing apparatus comprising:
- a stage structure elevatably mounting thereon a substrate to be written with a pattern by using a charged particle beam;
- a contact portion arranged contactable with the substrate by elevation of the substrate to thereby make electrical conduction with said substrate;
- and
- a plate-like spring member extending toward said substrate in a direction parallel with a surface of said substrate for causing said contact portion to be connected thereto substantially at a tip end of the plate-like spring, wherein
- said contact portion and said plate-like spring member are disposed so that a contact position at which said contact portion comes into contact with said substrate and a layout position of said plate-like spring member are substantially the same as each other with respect to an elevating direction of the stage in a state that said plate-like spring member is out of elastic deformation.
Dependencies are inferred from the claim text.