Semiconductor apparatus with semiconductor devices and cooling heat sinks

A semiconductor apparatus, comprising:

• a plurality of light-triggered type semiconductor devices, each light-triggered type semiconductor device having:
• a housing, and
• a groove provided on the housing for burying an optical fiber that supplies an optical gate signal into the housing, the optical fiber being provided in an L-shaped metal pipe;
• and
• a plurality of device cooling heat sinks, each device cooling heat sink having a thick wall part,
• wherein the plurality of light-triggered type semiconductor devices are connected in series,
• wherein each device cooling heat sink has a flow path for circulating a coolant medium, a coolant inlet, and a coolant outlet communicating with the flow path,
• wherein each device cooling heat sink is connected to at least two light-triggered type semiconductor devices,
• wherein an optical fiber insertion groove, which corresponds in position to the groove provided on the housing of the light-triggered type semiconductor device, is provided on a side surface of the device cooling heat sink, and formed in the thick wall part of the device cooling heat sink without intersecting the flow path, and
• wherein the L-shaped metal pipe is insertable in a hole defined by the optical fiber insertion groove and the groove provided on the housing after the light-triggered type semiconductor devices and the plurality of device cooling heat sinks are coupled into a single structure.