RFID packaging and attachment methods and devices
Assignee3M Innovative Properties Company
InventorsSwagata R. Banerjee, Jacob D. Chatterton, Justin M. Johnson, Michael C. Molinet, Robert A. Sainati
Life of this patent
Estimating the term…
Loading patent…
Assignee3M Innovative Properties Company
InventorsSwagata R. Banerjee, Jacob D. Chatterton, Justin M. Johnson, Michael C. Molinet, Robert A. Sainati
Estimating the term…
One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that is coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening in the signage and to electrically couple the integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.
An electrically conductive, RFID-enabled signage, comprising:
An assembled device capable of being physically coupled to an electrically conductive article including an opening, the assembled device capable of providing RFID functionality to the electrically conductive article such that the article becomes an electrically conductive, RFID-enabled signage, the assembled device comprising:
A kit, comprising:
A method of forming an RFID-enabled electrically conductive signage, comprising:
Dependencies are inferred from the claim text.