Semiconductor chips for TAG applications, devices for mounting the same, and mounting method

A semiconductor wafer including a plurality of semiconductor chips, individual ones of the semiconductor chips comprising:

• at least one integrated circuit element;
• an active identification and/or authentication element that provides for storing and exchanging information with regard to an object;
• a nonvolatile memory for storing information;
• a security circuit equipped with a non-erasable memory, the security circuit being adapted to block programming of the nonvolatile memory with regard to information contents of the non-erasable memory;
• and
• a handling element configured to enable handling of the semiconductor chip by a device,
• wherein the semiconductor wafer has a thickness of less than 100 μm.

A semiconductor wafer including a plurality of semiconductor chips, individual ones of the semiconductor chips comprising:

• at least one integrated circuit element;
• an active identification and/or authentication element that provides for storing and exchanging information with regard to an object;
• and
• a handling element comprising one of:
• a magnetic coating and an electrostatically chargeable structure, wherein:
• the handling element of at least one first semiconductor chip comprises a first magnetic force;
• the handling element of at least one second semiconductor chip comprises a second magnetic force, the first magnetic force being different from the second magnetic force;
• and
• the semiconductor wafer has a thickness of less than 100 μm.