Heat exchange system
OwnerJürgen Hertweckinventor
Life of this patent
Estimating the term…
Abstract
A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor units. The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit.
Claims14
A heat exchange system for an electronic device having high-performance processors or a high processor density, said heat exchange system comprising:
- (a) at least one primary cooling circuit comprising a first liquid coolant, a first active flow drive, a passive flow drive, and a first contact surface;
- (b) at least one secondary cooling circuit comprising a second liquid coolant, a second active flow drive, and a second contact surface;
- and
- (c) at least one processor unit assigned to said at least one secondary cooling circuit;
- wherein said at least one primary cooling circuit and said at least one secondary cooling circuit are thermally coupled so that heat absorbed by the at least one secondary cooling circuit is transferred by heat exchange to the at least one primary cooling circuit by way of the first contact surface and the second contact surface and is carried away or cooled off via the at least one primary cooling circuit;
- wherein the first liquid coolant of the at least one primary cooling circuit is driven via the first active flow drive in the at least one primary cooling circuit;
- wherein the passive flow drive is driven by motion of the first liquid coolant in the at least one primary cooling circuit;
- wherein the passive flow drive is coupled inductively or magnetically with the second active flow drive of the at least one secondary cooling circuit to transmit rotation magnetically or inductively to the second active flow drive, the second active flow drive driving the second liquid coolant in the at least one secondary cooling circuit;
- wherein the first and second liquid coolants can be differentiated and are separate from one another in terms of flow technology in that the first liquid coolant of the at least one primary cooling circuit is kept apart from the second liquid coolant of the at least one secondary cooling circuit;
- and
- wherein the at least one secondary cooling circuit is configured as a separate insertion element, or as an integral part of an insert, that is provided with said at least one processor unit.
Dependencies are inferred from the claim text.