Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same
AssigneeCree, Inc.
InventorsJeffrey S. Flynn, George R. Brandes
Life of this patent
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AssigneeCree, Inc.
InventorsJeffrey S. Flynn, George R. Brandes
Estimating the term…
A Group III-V nitride microelectronic device structure including a delta doped layer and/or a doped superlattice. A delta doping method is described, including the steps of: depositing semiconductor material on a substrate by a first epitaxial film growth process; terminating the deposition of semiconductor material on the substrate to present an epitaxial film surface; delta doping the semiconductor material at the epitaxial film surface, to form a delta doping layer thereon; terminating the delta doping; resuming deposition of semiconductor material to deposit semiconductor material on the delta doping layer, in a second epitaxial film growth process; and continuing the semiconductor material second epitaxial film growth process to a predetermined extent, to form a doped microelectronic device structure, wherein the delta doping layer is internalized in semiconductor material deposited in the first and second epitaxial film growth processes.
A Group III-V nitride microelectronic device structure comprising a high electron mobility transistor (HEMT) having a delta doped layer located in a barrier layer that is adjacent to a channel layer that provides a selectively operable conductive path between a source contact and a drain contact of the HEMT, wherein:
A microelectronic device structure comprising a high electron mobility transistor (HEMT) including:
Dependencies are inferred from the claim text.