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US 7,919,446 B1Granted
Post-CMP cleaning compositions and methods of using same
AssigneeIntermolecular, Inc.
InventorsZachary M. Fresco, Anh Duong, Chi-I Lang, Nikhil Kalyankar, Nicole Rutherford, Alexander Gorer
Life of this patent
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Abstract
Compositions comprise a purine compound; an alcohol amine; a quaternary ammonium salt; an amino acid, and optionally an antioxidant. The compositions are useful in post-CMP cleaning processes. One particular advantage of these compositions is that they can effectively remove slurry contamination without increasing the roughness of the copper surface.
Claims7
A post-CMP cleaning composition comprising:
- a) about 3 to about 7 weight percent tetramethylammonium hydroxide;
- b) about 0.5 to about 3 weight percent tryptophan;
- c) about 0.1 to about 0.6 weight percent guanosine;
- d) about 1 to about 5 weight percent of monoethanolamine;
- and
- e) balance water.
3 more elements
A process of cleaning a substrate after CMP of the substrate, comprising the steps of:
- a) preparing a composition comprising an amino acid, theobromine, an alcoholic amine, a quaternary ammonium salt, an antioxidant, and water;
- and
- b) contacting the composition with the substrate for a time and at a temperature ranging from about −5° C. to about 90° C. sufficient to remove substantially all CMP compounds remaining on the substrate after CMP.
Dependencies are inferred from the claim text.