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US 7,897,487 B2Granted
Laser processing method and chip
AssigneeHamamatsu Photonics K.K.
InventorsRyuji Sugiura, Takeshi Sakamoto
Life of this patent
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Abstract
An object to be processed can be cut highly accurately along a line to cut. An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.
Claims17
A chip having a side face substantially parallel to a thickness direction;
- wherein the side face is formed with:
- first and second modified regions arranged in a row in the thickness direction;
- a third modified region, positioned between the first and second modified regions, having a length in the thickness direction shorter than that of the first and second modified regions;
- and
- a plurality of Wallner lines bridging successively at least the first and second modified regions and extending obliquely with respect to the thickness direction,
- wherein at least one of said Wallner lines is configured so as to extend in a direction that crosses an advancing direction of fractures bridging the first and second modified regions by forming the third modified region, and
- wherein the third modified region is formed after forming the first and second modified regions.
4 more elements
Dependencies are inferred from the claim text.