Wafer center finding
AssigneeBrooks Automation, Inc.
InventorsPeter van der Meulen, Forrest T. Buzan
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Abstract
A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
Claims20
A method for finding a center of a wafer in a device having an interior and a plurality of entrances, the interior containing a robotic arm, and the device including a plurality of sensors, each one of the sensors adapted to detect a presence of the wafer at a predetermined location within the interior of the device, the method comprising:
- retrieving the wafer from outside the interior through a first one of the plurality of entrances;
- retracting the wafer into the interior and detecting a presence of the wafer with a first one of the plurality of sensors;
- rotating the robotic arm;
- extending the wafer out of the interior through a second one of the plurality of entrances and detecting an absence of the wafer with the first one of the plurality of sensors;
- and
- determining a location of a center of the wafer relative to the robotic arm using sensor data from the plurality of sensors and position data from the robotic arm.
A method for finding a center of a wafer in a device having an interior and a plurality of entrances, the interior containing a robotic arm, and the device including a plurality of sensors, each one of the sensors adapted to detect a presence of the wafer at a predetermined location within the interior of the device, the method comprising:
- retrieving the wafer from outside the interior through a first one of the plurality of entrances;
- retracting the wafer into the interior;
- rotating the robotic arm;
- extending the wafer out of the interior through a second one of the plurality of entrances;
- detecting the presence of the wafer at a predetermined location of at least one sensor during the retracting, rotating, and extending, thereby providing sensor data;
- and
- determining a location of a center of the wafer relative to the robotic arm using the sensor data and position data from the robotic arm.
Dependencies are inferred from the claim text.