Back to results
US 7,890,015 B2Granted
Cooling mechanism of fixing device
AssigneesKabushiki Kaisha Toshiba, Toshiba Tec Kabushiki Kaisha
InventorTakaho Watanabe
Life of this patent
Estimating the term…
Abstract
In a cooling mechanism for a fixing device according to an embodiment of the invention, a duct that flows outer air taken in by a fan is attached firmly to a slit formed between a bent coil part at an end part of a coil and a magnetic core in an induction heating device. The bent coil part is directly cooled without exerting influence of outer air on a heat roller, and temperature rise in the bent coil part is securely prevented.
Claims13
A cooling mechanism of a fixing device comprising:
- a metal member which comprises a metal layer;
- a counter-member configured to nip a recording medium together with the metal member;
- a magnetic core;
- a coil which is parallel to the metal layer in a flat part thereon and which is bent away from the metal layer to form a hole structure with the magnetic core at a bend part thereon, configured to generate an induction current in the metal layer;
- and
- a cooling section in contact which passes through the hole structure.
3 more elements
A cooling method for a fixing device comprising:
- generating an induction current in a metal member comprising a metal layer which together with a counter-member is configured to nip a recording medium, the induction current is generated by a coil that is parallel to the metal layer in a flat part thereon to form a hole structure with a magnetic core at a bend part on the coil;
- and
- sending a coolant to pass through the hole structure.
Dependencies are inferred from the claim text.