Semiconductor laser device
AssigneesSanyo Electric Co., Ltd., Tottori Sanyo Electric Co., Ltd.
InventorShoji Honda
Life of this patent
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Abstract
A semiconductor laser beam device, comprising a stem type package having a base part and a heat sink part, wherein the heat sink part is cylindrically formed so as to be concentric to the base part, a groove is formed along the axial direction of the heat sink part, and a semiconductor laser beam element is disposed at the bottom part of the inner wall surfaces of the groove whereby the radiating capability of the semiconductor laser beam device can be increased by increasing the volume of the heat sink part, and the element can be protected by the groove.
Claims12
A semiconductor laser device comprising:
- a cylindrical heat sink having a groove formed therein along an axial direction thereof and having an outer bottom surface thereof formed flat, the groove being increasingly wide in an upward direction and having planar side walls, wherein the distance between the side walls is greater at a top portion of the groove than at the bottom portion of the groove;
- and
- a semiconductor laser element placed on an inner wall surface of the groove.
A semiconductor laser device having a package comprising a base and a heat sink and having a semiconductor laser element placed on the heat sink, wherein the heat sink is cylindrical, in that a groove is formed in the heat sink along an axial direction thereof, the groove being increasingly wide in an upward direction and having planar side walls, wherein the distance between the side walls is greater at a top portion of the groove than at the bottom portion of the groove, in that the semiconductor laser element is placed on an inner wall surface of the groove, and in that the heat sink has an outer bottom surface thereof formed flat.
Dependencies are inferred from the claim text.