Wiring board, semiconductor device, and method of manufacturing the same

A semiconductor device comprising;

• a flat wiring board;
• a first semiconductor element disposed on one surface of said wiring board;
• and
• a second semiconductor element disposed on another surface of said wiring board, said wiring board comprising:
• a wiring layer;
• a sealing resin for covering said one surface and a side face of said first semiconductor element;
• a support layer for supporting said wiring layer, and a through-electrode that passes through said wiring layer and said support layer;
• and
• a plurality of lands on which external connection terminals are provided, wherein said first semiconductor element and said second semiconductor element are electrically connected,
• the plurality of lands include a first land, which is partially covered by the first semiconductor element when viewed from vertically above, and
• connection point between plurality of lands the first land and the wiring layer in the same plane as said first land, is formed outside fan outer periphery of an of the first semiconductor element, when viewed vertically from above.

A semiconductor device comprising:

• a flat wiring board;
• a first semiconductor element disposed on one surface of said wiring board;
• and
• a second semiconductor element disposed on another surface of said wiring board, said wiring board comprising:
• a wiring layer;
• a sealing resin for covering said one surface and a side face of said first semiconductor element;
• a support layer for supporting said wiring layer, and a through-electrode that passes through said wiring layer and said support layer;
• and
• a plurality of lands on which external connection terminals are provided, wherein said first semiconductor element and said second semiconductor element are electrically connected,
• at least one of said plurality of lands includes a projection, which is connected to the wiring layer formed in the same plane as said at least one land, when viewed vertically from above.

A semiconductor device comprising:

• a flat wiring board;
• a first semiconductor element disposed on one surface of said wiring board;
• and
• a second semiconductor element disposed on another surface of said wiring board, said wiring board comprising:
• a wiring layer;
• a sealing resin for covering said one surface and a side face of said first semiconductor element;
• a support layer for supporting said wiring layer, and a through-electrode that passes through said wiring layer and said support layer;
• and
• a plurality of lands on which external connection terminals are provided, wherein
• said first semiconductor element and said second semiconductor element are electrically connected,
• the plurality of lands include a first land, which is partially covered by the first semiconductor element when viewed from vertically above, and
• said first land includes a projection, which is connected to the wiring layer formed in the same plane as said first land, when viewed vertically from above.

A semiconductor device comprising:

• a flat wiring board;
• a first semiconductor element disposed on one surface of said wiring board;
• and
• a second semiconductor element disposed on another surface of said wiring board, said wiring board comprising:
• a wiring layer;
• a sealing resin for covering said one surface and a side face of said first semiconductor element;
• a support layer for supporting said wiring layer, and a through-electrode that passes through said wiring layer and said support layer;
• and
• a plurality of lands on which external connection terminals are provided, wherein said first semiconductor element and said second semiconductor element are electrically connected,
• connection portion between at least one of said plurality of lands, which is provided in the vicinity of an outer peripheral edge of the first semiconductor element, and the wiring layer formed in the same plane as said at least one land, is tapered only toward a predetermined side of the wiring board, when viewed from vertically above.

A semiconductor device comprising:

• a flat wiring board;
• a first semiconductor element disposed on one surface of said wiring board;
• and
• a second semiconductor element disposed on another surface of said wiring board, said wiring board comprising:
• a wiring layer;
• a sealing resin for covering said one surface and a side face of said first semiconductor element;
• a support layer for supporting said wiring layer, and a through-electrode that passes through said wiring layer and said support layer;
• and
• a plurality of lands on which external connection terminals are provided, wherein
• said first semiconductor element and said second semiconductor element are electrically connected,
• the plurality of lands include a first land, which is partially covered by the first semiconductor element, when viewed from vertically above,
• connection portion between the first land and the wiring layer formed in the same plane as said at least one land, is tapered only toward a predetermined side of the wiring board, when viewed from vertically above.