Current test probe having a solder guide portion, and related probe assembly and production method

A probe assembly for current test comprising:

• a probe board having a plurality of wiring paths with a plurality of land portions formed;
• and
• a plurality of probes secured to the land portions, wherein each probe of the plurality of probes comprises:
• a probe body having a plate-like connection portion whose end face is disposed opposite to its corresponding land portion, said connection portion having a first side face and a second side face;
• a preformed solder layer on said first side face of said connection portion;
• and
• a guide portion formed in said connection portion, said guide portion penetrating said connection portion in its thickness direction from said first side face to said second side face, wherein, when said preformed solder layer is melted, said guide portion guides melted solder toward and onto the second side face, and wherein the end face of said connection portion is secured to the corresponding land portion due to solidification of said melted solder on both the first side face and the second side face.