Substrate splitting apparatus and a method for splitting a substrate
AssigneeAu Optronics Corporation
InventorsLi-Ya Yeh, Chih-Wei Chu, Shu-Chih Wang, Wen-Chang Hsieh
Life of this patent
Estimating the term…
Loading patent…
AssigneeAu Optronics Corporation
InventorsLi-Ya Yeh, Chih-Wei Chu, Shu-Chih Wang, Wen-Chang Hsieh
Estimating the term…
A substrate splitting apparatus and a method for splitting a substrate using the substrate splitting apparatus are provided. The substrate splitting apparatus includes a servo motor, a transmission device, a substrate breaking bar, and a stage. One end of the transmission is directly or indirectly coupled to the servo motor while the other end is coupled with the breaking bar. The stage has a load-lock surface and the load-lock surface faces the breaking bar. The servo motor drives the transmission device to move the breaking bar toward the load-lock surface. A substrate with a pre-crack on the bottom is disposed on the load-lock surface. The servo motor drives the substrate breaking bar to move towards or away from the pre-crack. The method of splitting includes the following steps: forming a pre-crack on the substrate; controlling the servo motor to drive the breaking bar to move towards the substrate; and controlling the breaking bar to press the substrate at the pre-crack.
A substrate splitting apparatus comprising:
A substrate splitting method comprising the following steps:
A substrate splitting apparatus comprising:
A substrate splitting method comprising the following steps:
Dependencies are inferred from the claim text.