Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsYuichi Miyagawa, Takamitsu Noda, Hiroyasu Miyamoto, Jun Tsukano
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Abstract
A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.
Claims8
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted over said substrate;
- and
- an encapsulation resin encapsulating said semiconductor chip,
- wherein said encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between said first resin region and said second resin region so as to have said first resin composition and said second resin composition mixed therein.
A method of manufacturing semiconductor device comprising encapsulating a semiconductor chip mounted over a substrate using an encapsulation resin,
- wherein in said encapsulating the semiconductor chip, the encapsulation is allowed to proceed using a first resin composition and a second resin composition so that said encapsulation resin contains a first resin region composed of said first resin composition, a second resin region composed of said second resin composition, and a mixed layer formed between said first resin region and said second resin region so as to have said first resin composition and said second resin composition mixed therein.
Dependencies are inferred from the claim text.