Printed circuit board
AssigneeIbiden Co., Ltd.
InventorsTakashi Kariya, Hironori Tanaka
Life of this patent
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Abstract
A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.
Claims12
A printed circuit board comprising:
- a conductor portion;
- an insulating resin layer formed over the conductor portion;
- a thin-film capacitor formed over the insulating resin layer and comprising a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode;
- and
- a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion, the via-hole conductor structure having a first portion in the second electrode and a second portion in the insulating layer, the first portion of the via-hole conductor structure having a truncated-cone shape tapering toward the conductor portion along a first direction extending through the second electrode, and the second portion of the via-hole conductor structure extending through the insulating layer along a second direction different from the first direction such that the first portion and second portion of the via-hole conductor structure form an angle at a juncture of the first portion and the second portion.
Dependencies are inferred from the claim text.